Solarforestgroup redefined the high-efficiency module series by integrating 166mm silicon wafers with PERC and half-cut technologies. Solarforestgroup panel acmbined creative technology effectively and extremely improved the module efficiency and power out.
POWER
Maximum efficiency
Power Warranty
TEMP Coefficient
Max.Bifaciality
Solarforest Group has particularly optimized structure design and own the exclusive patent. The Monofacial module adopts 3.2 mm thickness glass on the front side, and the mechanical load capacity has increased greatly. When applying +5400/2400 Pa, the maximum structure stress of the module is 24% lower than the conventional structure design. The maximum deformation is 35% lower than the conventional structure, which can effectively decrease any risks.
Solarforest Group has particularly optimized structure design and own the exclusive patent. The Monofacial module adopts 3.2 mm thickness glass on the front side, and the mechanical load capacity has increased greatly. When applying +5400/2400 Pa, the maximum structure stress of the module is 24% lower than the conventional structure design. The maximum deformation is 35% lower than the conventional structure, which can effectively decrease any risks.
The working current of 166 modules is lower than 11A, which can be widely matched with distributed inverters, power optimizers and micro-inverters of different manufacturers and power segments around the world.
In the residential market segment, improving module efficiency to increase total installed capacity is paramount. In addition, in the installation form such as four-point installation, 166 modules have better load capacity.
395W+ ultra-high power
with 21% module efficiency
High density encapsulation
reduces the cell spacing to 0.5mm
Lower internal loss and the risk of micro-cracking due to multi-busbar cells
Less mismatch and parallel
design reduce shading impact
Significantly lower LCOE,
and more BoS savings
Perfect for utility
scale projects